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TSMC (TSM) said to be developing AI Chip packaging tech to counter Intel (INTC), The Information reports; effort at an early stage, unclear when it will reach commercial production

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TSMC is developing early-stage AI chip packaging to rival Intel's EMIB, aiming to secure its lead amidst 2026's critical global packaging capacity shortages and intensifying competition from Intel's foundry services.

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TSM reportedly developing tech internally referred to as "EMIB-like" to compete with Intel’s "Embedded Multi-die Interconnect Bridge".

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