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TSMC (TSM/2330 TT) will reportedly manufacture Xiaomi’s (XIACY/1810 HK) new Xring O3 smartphone processor using 3nm technology

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TSMC will reportedly produce Xiaomi's 3nm Xring O3 chip for an upcoming flagship foldable smartphone with targeted shipments of 200,000 to 300,000 units.

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The chip is expected to power Xiaomi’s upcoming flagship foldable phone, with targeted shipments of 200K-300K units

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TSMTaiwan Semiconductor Manufacturing Company Ltd.$414.39Current price

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