Nvidia (NVDA) and Supply Chain Partners expand capacity to accelerate AI infrastructure buildout

Substrate agreements with IBIDEN, Samsung Electro-Mechanics and Unimicron Technology Corporation will, in aggregate, drive a 2.5x increase in capacity over the next three years. Amkor (AMKR) plans to increase its advanced packaging capacity by more than 300% by the end of 2028. KYEC will build new facilities in the US, supported by a USD 1.1bln capacity reservation advance from NVIDIA. SPIL is targeting to increase its optical-engine capacity for co-packaged optics by 15x by mid-2027, with aims for another doubling by the end of 2028.